蔡司顯微鏡

Innovations in semiconductor packaging, such as new 2.5D/3D designs using through-silicon vias (TSVs) and chiplets using hybrid bonding, enable system-in-package (SIP) and heterogeneous integration. Characterization and failure analysis of these advanced technologies are critical for overall development and delivery of high-yielding, reliable products.

New package architectures introduce new types of defects buried deep below many layers, challenging the entire failure analysis workflow – from electrical characterization to physical analysis and root cause determination. Traditional workflows for high-resolution package analysis of buried features lack the required combination of speed, resolution, and 3D information to understand the problems.

Semiconductor products serve the needs of transportation, work, social communication, and industrial infrastructure. There is constant demand for higher computing performance in ever smaller form factors. Logic and memory semiconductor structure analysis is challenged by novel materials and increasingly complex geometries. Shrinking transistor sizes at the newest technology nodes demand the highest performance for electron microscopy and nanoprobing applications.

The mobile communication, Internet of Things (IoT), cloud computing, and the electrification of automotive industries are driving huge demand for high-performing “More than Moore” semiconductor devices, which require the integration of new materials and processes, or novel silicon architectures and packaging technologies such as micro-electromechanical systems (MEMS). Direct band gap and wide band gap materials such as gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) present new challenges to equipment manufacturers and device fabricators alike. Many of these devices also integrate traditional ICs, which creates fabrication and packaging challenges.

To shorten the development cycle and speed time to market on these sophisticated devices, manufacturers need advanced analysis tools that can support complex new materials integration and root-cause analysis of failures.

Consumer demand for brighter and more interactive display panels in electronic products is driving innovation in the highly competitive display industry. Display technology is evolving, with LCD and rigid organic light-emitting-diode (OLED) technology now produced in large volumes at low cost, and premium consumer products offering flexible OLED and microLED displays.

OLED, microLED and photonics applications are complex systems utilizing sensitive and difficult-to-analyze materials that demand advanced microscopy technologies in their development and manufacture.